Method of making an array of solar cells

ABSTRACT

Thermal isolation shields consisting of two glass slides separated by insulating standoffs are positioned upon the front radiation receiving surface of a solar cell and/or upon the back surface of the solar cell. One of the two glass plates is made from material selected to absorb and radiate electromagnetic wave energy with a wavelength above 5 microns to prevent overheating of the cell. The space between the two cover plates forms a thermal gap that is, if desired, bridged by a bimetallic strip. The strip is adhered to one of the plates and has a reverse bend to extend along the face surface of the opposed cover plate. The strip distorts under an increased temperature to break the bridge between the two plates and thereby isolates the solar cell from the thermal shield formed by the outer cover plate until there is a sufficient reduction in temperature at which the bimetallic strip reestablishes conductive contact between the cover plates. Each solar cell assembly in an array is adhered to a substrate by first bonding glass pads to the substrate and then heating the cell and glass pads to a temperature of about 400° while applying an electrical potential of the order of 400 volts with the glass being negative potential with respect to the cell. A hermetic bond is achieved without the use of adhesives.

This is a division of application Ser. No. 764,383 filed Jan. 31, 1977.

BACKGROUND OF THE INVENTION

This invention relates to solar energy collectors, and more particularlyto arranging spaced-apart and superimposed cover plates upon theradiation absorbing surface and/or the opposite surface containing anelectrical contact for a solar cell. Moreover, the present inventionrelates to a novel method for bonding such a solar cell onto a supportsurface through the use of glass pads and electrostatic bonding withoutthe use of adhesives.

Solar cells are conventionally arranged in an array for convertingincident solar radiation to electrical power. Each solar cell includes asubstrate of semiconductive material of one type conductivity forming aP-N junction with a layer of semiconductive material of the oppositetype conductivity. Solar cells of this type, particularly when used inspace missions, are vulnerable to thermal damage when exposed to eitherhighly concentrated sunlight or to continuous wave laser energy. Thevulnerable components of current solar cell designs are (1) the solderedinterconnects between the solar cells and the power distributionnetwork, (2) the adhesive bond between the substrate and the supportsurface as well as the bond between the cover slide and the cell, (3)the electrical parameters of the solar cell and (4) the cover slidematerial.

A single cover slide is conventionally adhered to the radiationreceiving surface of a solar cell through the use of special-purposeadhesives. Such adhesives frequently have a poor heat conductionproperty and must remain functional over an extended period of timewithout deterioration to the solar radiation transmission property.Should the adhesive become opaque to the spectrum of solar radiationparticularly useful for conversion to electrical power, then theeffectiveness of the solar cell is diminished. The wavelength of solarradiation which is particularly useful for conversion to electricalpower through the use of solar cells has an upper cutoff point at aboutthe wavelength of infrared, i.e., not above 5 microns. Thus, it becomesdesirable to shield the solar cell from infrared heat energy which has arelatively long wavelength to avoid overheating of the cell and protectthe vulnerable components as enumerated hereinbefore.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an improvedarrangement of cover slide members to form a thermal isolation shieldfor a solar cell.

It is a further object of the present invention to provide a doublecover slide separated by thermally-insulating standoffs to form athermal isolation shield for the front radiation receiving surface of asolar cell as well as the rear surface of the cell, if desired.

It is still another object of the present invention to provide a thermalisolation shield including spaced-apart cover slides separated by abridge which includes a bimetallic strip contacting the mutually-facingsurfaces of the cover slides and constructed in a manner to distortunder an increased temperature to deflect out of contact with one of thecover plates and thereby break the thermal bridge which is reestablishedupon cooling.

It is still a further object of the present invention to provide amethod for adhering solar cells onto a support surface by field-assistedelectrostatic bonding of a solar cell onto glass pads which have beenpreviously bonded onto a substrate material in a manner to carry out theentire mounting procedure without the use of adhesives.

According to the present invention, a solar radiation converter isprovided comprising the combination of means for convertingelectromagnetic wave energy into electrical energy, the means includinga substrate of semiconductive material of one type conductivity forminga P-N junction with a layer of semiconductive material of the oppositetype conductivity, the means having a receiver surface adapted forexposure to electromagnetic wave energy for conversion to electricalpower which is transmitted from the means by electrical interconnectsadhered to a surface thereof distinct from the radiation receivingsurface, a first cover plate covering at least one of the surfaces ofthe means for converting, a second cover plate covering the first coverplate in an outwardly, spaced-apart relation, one of the first andsecond cover plates being adapted to absorb and radiate incidentelectromagnetic wave energy with a wavelength above 5 microns, andstandoff members interposed between the first and second cover plates ina manner to form a gap therebetwen to define a thermal isolationbarrier.

The aforementioned first and second cover plates are preferably formedfrom glass material such as quartz. According to a further embodiment ofthe present invention, the combination further includes a bimetallicbridge in the gap formed by the standoff members between the coverplates, the bimetallic bridge contacting a face surface of each coverplate and bent over upon itself to deflect under thermal heating out ofcontact with one of the cover plates. The bridge is a composite of twodissimilar metal strips formed from metals selected from the groupconsisting of copper, aluminum and steel, or any metal having dissimilarthermal expansion coefficients.

The present invention further provides a method of making a bond betweena substrate and a solar cell by the steps including locating a glasssupport pad upon a substrate, bonding the pad onto the substrate toprovide a smooth, outwardly-facing support surface on the pad, arranginga solar cell upon the outwardly-facing support surface of the pad,heating the solar cell and the support pad to a temperature in the rangeof about 300° C to about 600° C, establishing an electrical field withinthe interface region between the solar cell and the support pad while inmutual contact in a manner such that the glass support pad has anegative electrical potential with respect to the solar cell,maintaining the electrical field between the heated support pad and theheated solar cell for a period of time sufficient to form a molecularbond, and thereafter cooling the solar cell and support pad and removingthe established electrical field.

According to the preferred method, a glass support pad is bonded ontothe substrate at each of a plurality of spaced-apart locations toprovide correspondingly-located, outwardly-facing smooth surfaces tosupport the solar cell for bonding thereto. The glass pads arepreferably fused silica and the surface on the cell to which the glasspad is adhered by the molecular bond is a polished aluminum surface. Itis preferred to heat the solar cell and support pad prior to bonding toa temperature of 400° while the electrostatic field is established at avoltage selected between about 400 to 500 volts.

These features and advantages of the present invention as well as otherswill be more fully understood when the following description is read inlight of the accompanying drawings, in which:

FIG. 1 illustrates a thermal isolation shield adhered to a face surfaceof a solar cell according to the present invention;

FIG. 2 is a graph showing the transmission spectra of quartz which isthe preferred material to form the cover slides in the thermal isolationshield;

FIG. 3 is a sectional view taken along line III--III of FIG. 1 butillustrating a modified form of a thermal shield including a bimetallicbridge;

FIG. 4 is a view similar to FIG. 3 but illustrating the deflection ofthe bimetallic bridge out of contact with a cover slide forming part ofthe thermal shield;

FIG. 5 is a perspective view of a solar cell adhered by glass pads to asupport substrate by the method of electrostatic bonding according tothe present invention; and

FIG. 6 is an expanded view illustrating the arrangement of parts andoperating parameters for the electrostatic bonding method of the presentinvention.

FIG. 1 illustrates the novel concept of the present invention addressedto a thermal isolation shield wherein a solar cell 10 is per seconstructed in a manner which is well known in the art and includes asubstrate 11 of semiconductive material of one type conductivity,typically silicon, forming a P-N junction with a layer of semiconductivematerial 12 of the opposite type conductivity. The outer face surface 13of the cell is adapted to receive incident electromagnetic wave energyfor conversion to electrical power by the cell. A soldered interconnectusually extends between the layer 12 of semiconductive material and apower distribution network. A second electrode formed, for example, by adeposited layer 14 of aluminum material upon the back face surface ofthe substrate 11 is also connected by a soldered interconnect to thepower distribution system.

According to the present invention a thermal isolation shield for thesolar cell includes a composite of two cover slides separated bythermally-insulated standoffs. It is to be understood that the compositeof two cover slides may be arranged as shown in FIG. 1 upon theradiation receiving surface 13 of the solar cell and/or upon the layer14 at the back surface of the solar cell. The construction of thethermal isolation shield is the same in either event. More specifically,an inner cover slide 20 is adhered to the face surface of the solar cellby the method of electrostatic bonding to be hereinafter more fullydescribed. Thermally-insulated standoffs 22 are arranged at the fourcorners of the cover slide 20 to carry an outer cover slide 24 in aspaced-apart relation with the cover slide 20. The material used to formthe standoffs 22 preferably is the same as the material which is used toform the cover slides. The material selected may be any suitablewell-known form of glass including quartz which has a transmissionspectrum illustrated by the graph in FIG. 2. In this regard, it will benoted that quartz has a transmission cutoff of incident solar radiationat about 5 microns. Thus, quartz is the particularly suitable materialto form at least one of the cover slides since such a cover slidefunctions effectively as a thermal isolation shield by absorbing longwavelength heat energy, i.e., above 5 microns and irradiates itpreferably back to space, i.e., away from the cell. However, the thermalisolation shield formed by the composite of cover slides 20 and 24 mustbe transparent to light in the visible spectrum.

FIG. 1 further illustrates the energy transfer mechanism provided by thethermal isolation shield. In this regard, the incident electromagneticenergy from the sun has an intensity of about 0.140 watt/cm² which isincident upon the cover slide 24. The radiated energy from cover slide24 is indicated by arrow 26 by the expression εAT⁴. In a similar manner,arrow 28 represents radiated energy from the substrate given by the sameexpression εAT⁴. Arrow 30 represents the output of electrical energy ata conversion efficiency rate of about 10%. Thus, it can be seen that theenergy absorbed by an array of such solar cells from the sun must beeither converted to electrical energy or irradiated back into space viathe front and/or back surface of each cell. The spaced-apart arrangementof cover slides 20 and 24 provides a secondary shield for the cellwhereby, under normal operating conditions, an increased operatingtemperature of the cell may be anticipated.

To facilitate maintaining a normal operating temperature over anextended temperature range, a further embodiment of the presentinvention, illustrated in FIGS. 3 and 4, has the unique feature of abimetallic bridge 32 interposed between the cover slides 20 and 24. Thebimetallic bridge 32 is formed from two thin strips 33 and 34 ofdissimilar metals having different thermal expansion properties so thatthey deflect within the elastic limits of the materials. The metals usedto form these strips are selected from the group consisting of copper,aluminum and steel or any metals having dissimilar thermal expansioncoefficients. The bridge has a strip-like form which is narrow and bentover on itself by a reverse bend. One leg of the bridge extends alongthe face surface at one or more marginal edges of either plate 20 orplate 24. It will be understood that the bridge may be bonded to eitherplate depending upon specific needs. For the purpose of describing theoperation of the bimetallic bridge, it will be assumed that a leg of thebridge is bonded to plate 20 whereby at a normal operating temperature,the remaining leg of the bridge extends along the face surface of plate24. When the cover slide and bridge experience a rise in temperature,the bimetallic strip bends away from the unbonded surface of plate 24,thus breaking thermal contact provided by the bridge between the celland the outer cover plate. The cell is now thermally isolated from theheat shield by the outer cover plate 24. This arrangement of parts isillustrated in FIG. 4 wherein it will be observed that the bimetallicbridge is deflected to form a gap between the bridge and cover plate 24.Special coatings may be selected to reflect a certain spectral region ofincident radiation. Such coatings are well known in the art and may beadded to either the cover plate 24 or cover plate 20 to increase thethermal isolation by selectively rejecting heat in specified energyintervals. Examples of such coatings are shown in U.S. Pat. Nos.3,076,681, 3,174,537, 3,272,986, 3,176,679 and 2,176,678.

According to a further feature of the present invention, afield-assisted electrostatic bonding method is employed to adhere thesolar cell onto a support substrate. The principle, per se, of sealingglass to metal at an elevated temperature under an applied electrostaticfield is described in a paper entitled "Field Assisted Glass-MetalSealing", Journal of Applied Physics, September 1969, Vol. 40, No. 10.The parameters of this sealing process have been modified by the methodof the present invention which may, if desired, be employed to adherethe cover slide 20 onto the face surface 13 of the cell and/or onto theface surface 14, depending on whether it is desired to provide thethermal isolation shield upon these surfaces of the cell. As describedhereinbefore, solar cells are typically arranged as an array of suchcells upon a suitable substrate which includes a distribution networkfor the electrical power generated by the cells. The substrate, as shownin FIGS. 5 and 6, consists of a pre-formed mat made from a lattice ofhigh-temperature material. The mat may be of any desired configurationbut typically includes a window opening 42. These openings are definedby parallel side rails 43 joined with cross members 44 which are spacedapart at a distance corresponding essentially to the height of the cell.Bonded onto the substrate material of the mat at spacings correspondingto the desired contact areas with the cell are pads 45 made from fusedsilica or other suitable glass material. The pads are bonded onto themat by thermal compression techniques which are per se well known in theart and may be employed without material change to the technique. Thepads 45 are important to the mounting method of the present inventionbecause they provide a smooth, outer face surface 46 to which the solarcell is bonded. The procedure for field-assisted electrostatic bondingincludes placing the solar cell upon the surfaces 46 provided by thepads 45 and then heating these parts to a temperature within the rangeof about 300° C to about 600° C, preferably 400° C. By the time thedesired elevated temperature is obtained, an electrostatic field isestablished between the cell and the pads. The electrostatic fieldresults from an electrical potential usually selected within the rangeof 400 to 500 volts direct current with the glass pad 45 having anegative potential with respect to the cell which, therefore, ismaintained at a positive potential. The applied electrostatic field tothe heated glass pads causes the ions in the heated glass to drifttoward the interface where the ions build up a tremendous pressure atthe interface to the extent that a molecular bond is formed within arelatively short period of time, usually within a period of time notexceeding two minutes. After cooling the heated parts and removing theelectrical field, a vacuum-tight and more specifically a hermetic sealis formed by the bond between the cell and the glass pads. It is notnecessary to arrange the parts within a vacuum chamber during thebonding process, although the process may be carried out within anevacuated chamber, if desired. The process is suitable for hermeticbonding of semiconductor materials onto glass as well as metal andglass.

Although the invention has been shown in connection with certainspecific embodiments, it will be readily apparent to those skilled inthe art that various changes in form and arrangement of parts may bemade to suit requirements without departing from the spirit and scope ofthe invention.

I claim as my invention:
 1. The method of making a bond between asubstrate and a solar cell capable of converting incidentelectromagnetic wave energy into electrical power, the method includingthe steps of:locating a glass support pad upon a substrate, bonding saidsupport pad onto said substrate to provide a smooth, outwardly-facingsupport surface on the pad, arranging said solar cell upon theoutwardly-facing support surface of the pad, heating the solar cell andsupport pad to a temperature within the range of about 300° C to about600° C, establishing an electrical field at a desired preselectedvoltage along the interface region between the solar cell and thesupport pad in a manner such that said glass support pad has a negativeelectrical potential with respect to the solar cell, maintaining saidelectrical field between the heated support pad and the heated solarcell for a period of time sufficient to form a molecular bond, andthereafter cooling the solar cell and support pad and removing theestablishing electrical field.
 2. The method according to claim 1wherein a glass support pad is bonded onto said substrate at each of aplurality of spaced-apart locations to provide correspondingly-located,outwardly-facing smooth surfaces adapted for supporting said solar cell.3. The method according to claim 2 wherein said substrate includes alattice of high-temperature material, and wherein the glass support padsare fused silica.
 4. The method according to claim 2 wherein said solarcell has a metal surface maintained at a positive potential by saidestablishing an electrical field.
 5. The method according to claim 4wherein said metal surface of the solar cell is arranged to contact saidsmooth, outwardly-facing surface on said pad.
 6. The method according toclaim 4 wherein said metal surface is polished aluminum.
 7. The methodaccording to claim 1 wherein said electrical field is established at avoltage selected between 400 and 500 volts.
 8. The method according toclaim 1 wherein said solar cell and support pad are heated to atemperature of approximately 400° C.